PFDS400^®

PFDS400^®

Under the brand name PFDS400® (Preform-based diffusion soldering technology for high temperature applications: above 400 °C), PFARR Stanztechnik offers a revolutionary multi-layer solder range. Using conventional soldering processes with short dwell maximum peak temperatures of 250 °C, these new composite materials produce complete intermetallic phases (IMPs) in the Lead-free solder junctions without pressure or reheating. The resulting structure exhibits a re-melt temperature of over 400 °C.

The composite materials are made from multi-layer systems of tin-based, lead-free solders, together with high melting point metals such as Copper (Cu). The overall thickness ranges from 50 μm to 300 μm. Other alloys and dimensions are available on request.

We will be pleased to provide a quotation:  Sales