Landal-Seal®
Landal-Seal®
In presenting the patented lead-free solder composition Landal-Seal® PFARR Stanztechnik pushed back the barriers of existing solder technology. The revolutionary composition imparts the material with unusual physical and metallurgical properties: its stability to temperature cycling is around three times higher than that of conventional SnAgCu [SAC] solders, while its special chemical makeup inhibits the formation of Tin whiskers; presenting a much smoother surface finish ideal for positioning BGA solder balls via laser triangulation.
With a eutectic melting point of 214 °C, Landal-Seal® is ideal for a wide range of soldering applications.
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