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High purity soft solder bismuth-tin alloys eutectic melting point 138 centigrade

The eutectic composition Bi(58)Sn(42) is insertable for soldering temperature-sensitive electronic components. Due to his low melting point it`s possible to operate at low soldering temperatures. Possible fields of application are special requirements in semiconductor assembly and high frequency technology or as fusible safety devices. PFARR offers this soldering composition for high quality applications in customised dimensions with close tolerances. The special adjusted production process allows manufacturing of accurate preforms, ribbons, foils and spheres.